Cooling Chips Still A Top Challenge
Heat pipes, lids, thermal interfaces, and micro-channel cooling help remove the heat generated by chips.
Mask Complexity, Cost, And Change
Evolving lithography demands are challenging mask writing technology; shift to curvilinear is underway.
Advanced Packaging Depends On Materials And Co-Design
New materials play a pivotal role, but solving integration problems remains a challenge.
Can Chiplets Serve Cost-Conscious Apps?
The economics are not yet clear for industrial or consumer electronics.
Packaging With Fewer People And Better Results
Manufacturers are turning to automation, AI, and robotics to boost repeatability, cut costs, and support heterogeneous integration.
Advanced Packaging Fundamentals for Semiconductor Engineers
New SE eBook examines the next phase of semiconductor design, testing, and manufacturing.
Benefits And Challenges In Multi-Die Assemblies
What makes advanced packaging so attractive to some companies, but not others.
What Exactly Are Chiplets And Heterogeneous Integration?
New technologies drive new terminology, but the early days for those new approaches can be very confusing.
Many Options For EUV Photoresists, No Clear Winner
Chip industry searching for optimal balance of sensitivity, resolution, and LWR at leading-edge nodes.
Challenges Grow For Medical ICs
Making devices that are defect-free and able to withstand years of harsh environments is made more difficult by a combination of low volume and hig...
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Mask Complexity, Cost, And Change
Evolving lithography demands are challenging mask writing technology; shift to curvilinear is underway.
Benefits And Challenges In Multi-Die Assemblies
What makes advanced packaging so attractive to some companies, but not others.
What’s Next In Advanced Packaging?
Momentum is building for organic interposers, 3D stacking, and photonics, but questions remain about how the industry gets there and what kinds of ...
Advanced Packaging Moving At Breakneck Pace
A chiplet supermarket is still years off, but progress is being made on all fronts.
One Chip Vs. Many Chiplets
Challenges and options vary widely depending on markets, workloads, and economics.
More Roundtables »
Big Changes In Medical Electronics
How in-field devices will change health care, and what's needed to make it work.
Emerging Technologies Driving Heterogeneous Integration
New architectures, opportunities, and challenges as chipmakers move from monolithic architectures to chiplets.
Secure Movement Of Data In Test
Why heterogeneous integration changes how data is used in manufacturing.
Challenges Of Testing Advanced Packages
Bundling more chips or chiplets increases the difficulty of thoroughly testing a device.
High-NA EUV Progress And Problems
Why it's necessary, when it's coming, and what still needs to be done.
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