Examining Mechanical Deformation In Advanced Logic Devices To Enhance Yield


By Sandy Wen and Jacky Huang As dimensions shrink and aspect ratios increase in advanced logic devices, it is increasingly important to reduce structural device variation. Structural device variations can be a proxy for device yield. These variations might include critical dimension (CD), gate CD, gate height, and proximity between neighboring vias. One contributor to structural device v... » read more

Power Delivery Challenges For AI Chips


As artificial intelligence (AI) workloads grow larger and more complex, the various processing elements being developed to process all that data are demanding unprecedented levels of power. But delivering this power efficiently and reliably, without degrading signal integrity or introducing thermal bottlenecks, has created some of the toughest design and manufacturing challenges in semiconducto... » read more

How To Catch “Disappearing” Latent Defects


Automotive is demanding more emphasis on chip reliability. By 2020, electronic devices will account for over 35% of the manufacturing cost of an automobile, and by 2030, that number is expected to rise to 50%. Tens of thousands of cars are manufactured each day, with each car using thousands of chips — and if even one of those chips fails in the field it may have disastrous consequences: los... » read more

Variable Bias Completes The PLDC Model And Offers Superior MPC Results


This is the third in a three-blog series on PLDC. The first installment was “Improving Uniformity and Linearity for All Masks,” from January 29, 2025. The second blog was “Three Ways Curvy ILT Together with PLDC Improves Wafer Uniformity,” from April 18, 2025. In 2024, the eBeam Initiative Luminaries Survey found that the number one concern in adoption of curvilinear mask features wa... » read more

Improving Fab Engineering Efficiency With Autonomous Data Analytics


During my earlier career as a process integration engineer, one of my primary responsibilities was to find yield enhancement opportunities by investigating underlying relationships between bin failures and process parameters within the fab. While performing this analysis, there were many impediments to identifying relationships among different data types: sort maps, electrical test maps, parame... » read more

Physics Limits Interposer Line Lengths


Electrical interposers provide a convenient surface for mounting multiple chips within a single package, but even though interposer lines theoretically can be routed anywhere, insertion losses limit their practical length. Lines on interposers — and on silicon interposers in particular — can be exceedingly narrow. Having a small cross-section makes such lines resistive, degrading signals... » read more

Path To Net-Zero Emissions In IC Packaging


To strengthen climate resilience and accelerate towards net-zero emissions, ASE has implemented comprehensive carbon reduction strategies and management frameworks to practice responsible actions and achieve performance results. In our efforts to reduce our carbon footprint, we strive to design production facilities and processes that prioritize eco-efficient production and the creation of en... » read more

How An Environmental Sustainability Community Fostered Employee-Driven Innovation


Co-written by S. Sinan Erzurumlu (Babson College), Wojciech T. Osowiecki (Lam Research) and Victor P. Seidel (Babson College). Firms are increasingly promoting innovations that advance environmental sustainability across all aspects of their business, but this can be challenging in global, complex, technology-focused organizations. Much research has focused on top-down strategic initiatives;... » read more

2025 Impact Report: Environmental, Social and Governance Efforts


Brewer Science’s Impact Report 2025 tracks progress on goals set in environment, social and governance, including: Progress towards reducing carbon footprint for Scope 1 and Scope 2 GHG by 80% from baselines (2018) by 2030 Progress towards achieving net zero carbon footprint by 2050 Progress towards creating a circular supply chain, prioritizing collaboration ... » read more

Critical Minerals Due Diligence And The Semiconductor Supply Chain


“Critical minerals our world needs for electric vehicles and semiconductors can be found here. Clean energy we need to power artificial intelligence data centers and economic growth can be built here.”[1] This statement was made by former US President Joseph Biden during his visit to Angola in December 2024 to support a US-funded railroad project called the Lobito Corridor. The railroad wou... » read more

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