tag: verification

On-Chiplet Framework for Verifying Physical Security and Integrity of Adjacent Chiplets
By Technical Paper Link - 29 Apr, 2025 - Comments: 0

A new technical paper titled "ChipletQuake: On-die Digital Impedance Sensing for Chiplet and Interposer Verification" was published by researchers at Worcester Polytechnic Institute. Abstract "The increasing complexity and cost of manufacturing monolithic chips have driven the semiconductor industry toward chiplet-based designs, where smaller and modular chiplets are integrated onto a singl... » read more

Tape-Out Failures Are The Tip Of The Iceberg
By Brian Bailey - 24 Apr, 2025 - Comments: 5

The headline numbers for the new Wilson Research/Siemens functional verification survey are out, and it shows a dramatic decline in the number of designs that are functionally correct and manufacturable. In the past year, that has dropped from 24% to just 14%. Along with that, there is a dramatic increase in the number of designs that are behind schedule, increasing from 67% to 75%. Over the ne... » read more

AI-Driven Verification Regression Management
By Paul Carzola - 24 Apr, 2025 - Comments: 0

By Paul Carzola and Taruna Reddy Coping with the endless growth in chip size and complexity requires innovative electronic design automation (EDA) solutions at every stage of the development process. Better algorithms, increased parallelism, higher levels of abstraction, execution on graphics processing units (GPUs), and use of AI and machine learning (ML) all contribute to these solutions. ... » read more

Analog Creates Ripples in Digital Verification
By Brian Bailey - 24 Apr, 2025 - Comments: 0

We live in an analog world, but analog has been minimized whenever possible. At some point digital and analog must come together in every electronic device, and that has long been an area where errors creep in. The Wilson Research Group and Siemens EDA functional verification study has long shown that analog and mixed signal are two of the highest causes of flaws that result in chip respins.... » read more

AI Agents Need Goals
By Brian Bailey - 16 Apr, 2025 - Comments: 0

Experts At The Table: Definitions and goals matter when it comes to using AI effectively, and it has to be tightly reined in to be effective. Semiconductor Engineering sat down with a panel of experts to discuss these issues and others, including Johannes Stahl, senior director of product line management for the Systems Design Group at Synopsys; Michael Young, director of product marketing for ... » read more

HyperLynx
By Siemens EDA - 03 Apr, 2025 - Comments: 0

You gain the full power of HyperLynx when it is fully integrated as part of the Xpedition PCB design flow. Yet, it also interfaces with most PCB layout tools, allowing any engineer to quickly import and set up their PCB designs for analysis, regardless of their existing toolset. And because its progressive verification methodology analyzes a design in stages, HyperLynx locates issues earlier an... » read more

LLM-based Agentic Framework Automating HW Security Threat Modeling And Test Plan Generation (U. of Florida)
By Technical Paper Link - 01 Apr, 2025 - Comments: 0

A new technical paper titled "ThreatLens: LLM-guided Threat Modeling and Test Plan Generation for Hardware Security Verification" was published by researchers at University of Florida. Abstract "Current hardware security verification processes predominantly rely on manual threat modeling and test plan generation, which are labor-intensive, error-prone, and struggle to scale with increasing ... » read more

How AI And Connected Workflows Will Close The Verification Bottleneck
By Harry Foster - 27 Mar, 2025 - Comments: 0

For decades, verification has been the unsung hero of chip development—quietly catching bugs before they reach silicon. But as semiconductor complexity has skyrocketed, verification has turned into the bottleneck of development cycles. This challenge has a name: Verification Productivity Gap 2.0. Back in the early 2000s, the Verification Productivity Gap 1.0 emerged when design complexi... » read more

First-Time Silicon Success Plummets
By Ed Sperling - 27 Mar, 2025 - Comments: 0

First-time silicon success is falling sharply due to rising complexity, the need for more iterations as chipmakers shift from monolithic chips to multi-die assemblies, and an increasing amount of customization that makes design and verification more time-consuming. Details from a new functional verification survey[1] highlight the growing difficulty of developing advanced chips that are both... » read more

Digital Twins For Design And Verification Workflows
By Brian Bailey - 27 Mar, 2025 - Comments: 0

Experts At The Table: AI is starting to impact several parts of the EDA design and verification flows, but so far these improvements are isolated to a single tool or small flows provided by a single company. What is required is a digital twin of the development process itself, on which AI can operate. Semiconductor Engineering sat down with a panel of experts, including Johannes Stahl, senior d... » read more

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